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Known Good Die
PB6800
SiC KGD Die Handler

Nexustest PB6800 is a high-end SiC KGD Die Handler widely used in the semiconductor industry, specializing in dynamic and static parameter testing of bare die-level SiC power chips. It adopts a modular design and supports multiple chip feeding methods, including Frame Ring, Tape & Reel, and Tray. The system also supports Hard Docking connection and multi-station room/high-temperature testing, equipped with high-voltage anti-arcing functionality.

Highlights
  • Excellent scalability
    Modular design with loading, unloading, and multiple test stations
  • Six-channel parallel testing
    Supports up to 2 temperature zones for testing
    Different test stations support varying test conditions and items
  • Dynamic, Static, and UIS Tests
    Static test 2000 V/ 600 A
    Dynamic test 1200 V/ 2000 A
  • Modular unloading design
    Supports unloading in wafer / wafer + tape & reel / wafer + auto tray configurations
  • Precise temperature control
    Range: RT ~ 200°C
    Accuracy: ±3°C
    Resolution: 0.1°C
  • Airtight socket design
    Prevents high-voltage arcing through nitrogen protection and air pressure monitoring
  • Good maintainability
    Supports automatic socket replacement in case of die failure, improving equipment uptime
  • Efficient multi-station
    Up to 6 test stations with a test time of 0.7s and UPH > 4000

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