Necessity of wafer reliability test in vehicle specification SiC chip:

According to the bathtub curve theory, any electronic component will have a high failure rate at the beginning of its life cycle, and the failure rate will obviously drop to the stable period with the passage of time.

The SiC Power Module of the vehicle gauge is different from the ordinary to package device. There is only one die inside the ordinary to package device. If it fails, only a single device needs to be replaced. However, the SiC Power Module of the vehicle gauge protects dozens of dies. If one die fails, the performance of the whole module will be affected. Therefore, if bad dies can be screened out from the wafer in advance, the yield of packaged modules and the life cycle of modules can be greatly improved.

Nexustest provides a complete set of solutions for wafer aging, including CP loading machine wafer burn-in unloading machine KGD to solve the complete set of test solutions before packaging into modules.

Wafer Level Burn-In System: WLBI3800

1，Automated Loading and Unloading

Fully automated wafer handling minimizes manual intervention, boosting efficiency and accuracy

Delivers ±25μm probe mark repositioning accuracy for reliable testing

Supports map data binding for traceability and testing up to 2112 dies simultaneously

Automatically switches between HTGB and HTRB modes

Igss and Idss leakage current moitoring

Includes Vth parameter testing for in-depth analysis

Offers maximum resolution of 0.1nA

Ensures uniformity within ±3℃, accuracy within 1℃, and resolution of 0.1℃